CVE-2023-21630: qualcomm, inc. snapdragon Integer Underflow (Wrap or Wraparound)

Vulnerability summary

CVE-2023-21630 is a high (CVSS 8.4) Integer Underflow (Wrap or Wraparound) vulnerability in qualcomm, inc. snapdragon. EPSS estimates a 0.12% chance of exploitation in the next 30 days, higher than 1.5% of scored vulnerabilities.

Timeline

1. 04-04-2023
   PublishedVulnerability first disclosed.
2. 02-08-2024
   Last modifiedVulnerability information updated.

Description

Memory Corruption in Multimedia Framework due to integer overflow when synx bind is called along with synx signal.

• CWE-191Integer Underflow (Wrap or Wraparound)The product subtracts one value from another, such that the result is less than the minimum allowable integer value, which produces a value that is not equal to the correct result.
• CWE-190Integer Overflow or WraparoundThe product performs a calculation that can produce an integer overflow or wraparound when the logic assumes that the resulting value will always be larger than the original value. This occurs when an integer value is incremented to a value that is too large to store in the associated representation. When this occurs, the value may become a very small or negative number.