Qualcomm Snapdragon 870 5G Mobile Platform \(Sm8250 Ac\) vulnerabilities
68 vulnerabilities
Known vulnerabilities in Qualcomm Snapdragon 870 5G Mobile Platform \(Sm8250 Ac\), newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.
CVE-2025-21479qualcomm, inc.snapdragon+74KEV
EPSS score0.84%
Memory corruption due to unauthorized command execution in GPU micronode while executing specific sequence of commands.CVE-2025-21487qualcomm, inc.snapdragon+225EPSS score0.26%
Information disclosure while decoding RTP packet received by UE from the network, when payload length mentioned is greater than the available buffer length.CVE-2025-21484qualcomm, inc.snapdragon+173EPSS score0.26%
Information disclosure when UE receives the RTP packet from the network, while decoding and reassembling the fragments from RTP packet.CVE-2025-21429qualcomm, inc.snapdragon+182EPSS score0.26%
Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request.CVE-2025-21480qualcomm, inc.snapdragon+75KEVEPSS score0.46%
Memory corruption due to unauthorized command execution in GPU micronode while executing specific sequence of commands.CVE-2025-21464qualcomm, inc.snapdragon+340EPSS score0.09%
Information disclosure while reading data from an image using specified offset and size parameters.CVE-2025-21452qualcomm, inc.snapdragon+80EPSS score0.21%
Transient DOS while processing a random-access response (RAR) with an invalid PDU length on LTE network.CVE-2025-21430qualcomm, inc.snapdragon+223EPSS score0.26%
Transient DOS while connecting STA to AP and initiating ADD TS request from AP to establish TSpec session.CVE-2025-21448qualcomm, inc.snapdragon+267EPSS score0.26%
Transient DOS may occur while parsing SSID in action frames.CVE-2025-21477qualcomm, inc.snapdragon+87EPSS score0.22%
Transient DOS while processing CCCH data when NW sends data with invalid length.CVE-2025-21474qualcomm, inc.snapdragon+45EPSS score0.09%
Memory corruption while processing commands from A2dp sink command queue.CVE-2025-21481qualcomm, inc.snapdragon+249EPSS score0.07%
Memory corruption while performing private key encryption in trusted application.CVE-2025-21435qualcomm, inc.snapdragon+149EPSS score0.26%
Transient DOS may occur while parsing extended IE in beacon.CVE-2025-21483qualcomm, inc.snapdragon+225EPSS score0.42%
Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.CVE-2025-21482qualcomm, inc.snapdragon+287EPSS score0.09%
Cryptographic issue while performing RSA PKCS padding decoding.CVE-2025-21455qualcomm, inc.snapdragon+29EPSS score0.07%
Memory corruption while submitting blob data to kernel space though IOCTL.CVE-2025-21465qualcomm, inc.snapdragon+347EPSS score0.09%
Information disclosure while processing the hash segment in an MBN file.CVE-2025-47318qualcomm, inc.snapdragon+202EPSS score0.21%
Transient DOS while parsing the EPTM test control message to get the test pattern.CVE-2025-47348qualcomm, inc.snapdragon+202EPSS score0.08%
Memory corruption while processing identity credential operations in the trusted application.CVE-2025-47320qualcomm, inc.snapdragon+212EPSS score0.08%
Memory corruption while processing MFC channel configuration during music playback.