Qualcomm Snapdragon 870 5G Mobile Platform \(Sm8250 Ac\) vulnerabilities, page 2
68 vulnerabilities
Known vulnerabilities in Qualcomm Snapdragon 870 5G Mobile Platform \(Sm8250 Ac\), newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.
CVE-2025-47333qualcomm, inc.snapdragon+237
EPSS score0.08%
Memory corruption while handling buffer mapping operations in the cryptographic driver.CVE-2025-47331qualcomm, inc.snapdragon+297EPSS score0.08%
Information disclosure while processing a firmware event.CVE-2025-47369qualcomm, inc.snapdragon+173EPSS score0.08%
Information disclosure when a weak hashed value is returned to userland code in response to a IOCTL call to obtain a session ID.CVE-2025-47330qualcomm, inc.snapdragon+221EPSS score0.07%
Transient DOS while parsing video packets received from the video firmware.CVE-2025-27032qualcomm, inc.snapdragon+191EPSS score0.08%
memory corruption while loading a PIL authenticated VM, when authenticated VM image is loaded without maintaining cache coherency.CVE-2025-27070qualcomm, inc.snapdragon+174EPSS score0.06%
Memory corruption while performing encryption and decryption commands.CVE-2025-27071qualcomm, inc.snapdragon+34EPSS score0.18%
Memory corruption while processing specific files in Powerline Communication Firmware.CVE-2025-27063qualcomm, inc.snapdragon+111EPSS score0.10%
Memory corruption during video playback when video session open fails with time out error.CVE-2025-27034qualcomm, inc.snapdragon+111EPSS score0.41%
Memory corruption while selecting the PLMN from SOR failed list.CVE-2025-27037qualcomm, inc.snapdragon+37EPSS score0.09%
Memory corruption while processing config_dev IOCTL when camera kernel driver drops its reference to CPU buffers.CVE-2025-27073qualcomm, inc.snapdragon+169EPSS score0.22%
Transient DOS while creating NDP instance.CVE-2025-27054qualcomm, inc.snapdragon+297EPSS score0.09%
Memory corruption while processing a malformed license file during reboot.CVE-2025-27065qualcomm, inc.snapdragon+149EPSS score0.22%
Transient DOS while processing a frame with malformed shared-key descriptor.CVE-2025-27053qualcomm, inc.snapdragon+317EPSS score0.09%
Memory corruption during PlayReady APP usecase while processing TA commands.CVE-2025-27066qualcomm, inc.snapdragon+370EPSS score0.28%
Transient DOS while processing an ANQP message.CVE-2024-21479qualcomm, inc.snapdragon+94EPSS score0.32%
Transient DOS during music playback of ALAC content.CVE-2024-21459qualcomm, inc.snapdragon+175EPSS score0.26%
Information disclosure while handling beacon or probe response frame in STA.CVE-2024-21481qualcomm, inc.snapdragon+165EPSS score0.11%
Memory corruption when preparing a shared memory notification for a memparcel in Resource Manager.CVE-2024-21467qualcomm, inc.snapdragon+129EPSS score0.26%
Information disclosure while handling beacon probe frame during scan entry generation in client side.CVE-2024-43067qualcomm, inc.snapdragon+58EPSS score0.09%
Memory corruption occurs during the copying of read data from the EEPROM because the IO configuration is exposed as shared memory.