Qualcomm, Inc. Snapdragon vulnerabilities

997 vulnerabilities

Known vulnerabilities in Qualcomm, Inc. Snapdragon, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.

7.8CVE-2018-11816qualcomm, inc.snapdragon+14
EPSS score
0.11%
Crafted Binder Request Causes Heap UAF in MediaServer
7.8CVE-2018-11952qualcomm, inc.snapdragon+23
EPSS score
0.11%
An image with a version lower than the fuse version may potentially be booted lead to improper authentication.
7.5CVE-2018-11922qualcomm, inc.snapdragon+22
EPSS score
0.23%
Wrong configuration in Touch Pal application can collect user behavior data without awareness by the user.
8.4CVE-2018-5852qualcomm, inc.snapdragon+23
EPSS score
0.12%
An unsigned integer underflow vulnerability in IPA driver result into a buffer over-read while reading NAT entry using debugfs command 'cat /sys/kernel/debug/ipa/ip4_nat'
6.7CVE-2021-30299qualcomm, inc.snapdragon+84
EPSS score
0.12%
Possible out of bound access in audio module due to lack of validation of user provided input.
7.8CVE-2016-10408qualcomm, inc.snapdragon+5
EPSS score
0.10%
QSEE will randomly experience a fatal error during execution due to speculative instruction fetches from device memory. Device memory is not valid executable memory.
9.8CVE-2016-10394qualcomm, inc.snapdragon+5
EPSS score
0.10%
Initial xbl_sec revision does not have all the debug policy features and critical checks.
7.8CVE-2025-21467qualcomm, inc.snapdragon+103
EPSS score
0.11%
Memory corruption while reading the FW response from the shared queue.
8.6CVE-2025-21479qualcomm, inc.snapdragon+74KEV
EPSS score
0.84%
Memory corruption due to unauthorized command execution in GPU micronode while executing specific sequence of commands.
7.8CVE-2025-21466qualcomm, inc.snapdragon+40
EPSS score
0.10%
Memory corruption while processing a private escape command in an event trigger.
7.8CVE-2025-21425qualcomm, inc.snapdragon+33
EPSS score
0.09%
Memory corruption may occur due top improper access control in HAB process.
8.2CVE-2025-21487qualcomm, inc.snapdragon+225
EPSS score
0.26%
Information disclosure while decoding RTP packet received by UE from the network, when payload length mentioned is greater than the available buffer length.
7.8CVE-2025-21447qualcomm, inc.snapdragon+8
EPSS score
0.11%
Memory corruption may occur while processing device IO control call for session control.
8.2CVE-2025-21484qualcomm, inc.snapdragon+173
EPSS score
0.26%
Information disclosure when UE receives the RTP packet from the network, while decoding and reassembling the fragments from RTP packet.
5.5CVE-2025-21472qualcomm, inc.snapdragon+12
EPSS score
0.09%
Information disclosure while capturing logs as eSE debug messages are logged.
7.8CVE-2025-21444qualcomm, inc.snapdragon+27
EPSS score
0.10%
Memory corruption while copying the result to the transmission queue in EMAC.
7.5CVE-2025-21429qualcomm, inc.snapdragon+182
EPSS score
0.26%
Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request.
8.6CVE-2025-21480qualcomm, inc.snapdragon+75KEV
EPSS score
0.46%
Memory corruption due to unauthorized command execution in GPU micronode while executing specific sequence of commands.
7.8CVE-2025-21440qualcomm, inc.snapdragon+49
EPSS score
0.11%
Memory corruption when IOCTL call is invoked from user-space to write board data to WLAN driver.
6.2CVE-2025-21433qualcomm, inc.snapdragon+268
EPSS score
0.09%
Transient DOS when importing a PKCS#8-encoded RSA private key with a zero-sized modulus.