Qualcomm, Inc. Snapdragon vulnerabilities, page 2
997 vulnerabilities
Known vulnerabilities in Qualcomm, Inc. Snapdragon, newest first, with CVSS severity, EPSS, KEV listings, ransomware use and the affected versions.
CVE-2025-21427qualcomm, inc.snapdragon+172
EPSS score0.24%
Information disclosure while decoding this RTP packet Payload when UE receives the RTP packet from the network.CVE-2025-21424qualcomm, inc.snapdragon+233EPSS score0.12%
Memory corruption while calling the NPU driver APIs concurrently.CVE-2025-21464qualcomm, inc.snapdragon+340EPSS score0.09%
Information disclosure while reading data from an image using specified offset and size parameters.CVE-2025-21450qualcomm, inc.snapdragon+104EPSS score0.32%
Cryptographic issue occurs due to use of insecure connection method while downloading.CVE-2025-21431qualcomm, inc.snapdragon+36EPSS score0.08%
Information disclosure may be there when a guest VM is connected.CVE-2025-21454qualcomm, inc.snapdragon+185EPSS score0.24%
Transient DOS while processing received beacon frame.CVE-2025-21457qualcomm, inc.snapdragon+15EPSS score0.09%
Information disclosure while opening a fastrpc session when domain is not sanitized.CVE-2025-21452qualcomm, inc.snapdragon+80EPSS score0.21%
Transient DOS while processing a random-access response (RAR) with an invalid PDU length on LTE network.CVE-2025-21430qualcomm, inc.snapdragon+223EPSS score0.26%
Transient DOS while connecting STA to AP and initiating ADD TS request from AP to establish TSpec session.CVE-2025-21486qualcomm, inc.snapdragon+31EPSS score0.10%
Memory corruption during dynamic process creation call when client is only passing address and length of shell binary.CVE-2025-21448qualcomm, inc.snapdragon+267EPSS score0.26%
Transient DOS may occur while parsing SSID in action frames.CVE-2025-21428qualcomm, inc.snapdragon+69EPSS score0.26%
Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request from the AP to establish a TSpec session.CVE-2025-21436qualcomm, inc.snapdragon+25EPSS score0.11%
Memory corruption may occur while initiating two IOCTL calls simultaneously to create processes from two different threads.CVE-2025-21426qualcomm, inc.snapdragon+10EPSS score0.10%
Memory corruption while processing camera TPG write request.CVE-2025-21468qualcomm, inc.snapdragon+146EPSS score0.11%
Memory corruption while reading response from FW, when buffer size is changed by FW while driver is using this size to write null character at the end of buffer.CVE-2025-21461qualcomm, inc.snapdragon+24EPSS score0.09%
Memory corruption when programming registers through virtual CDM.CVE-2025-21477qualcomm, inc.snapdragon+87EPSS score0.22%
Transient DOS while processing CCCH data when NW sends data with invalid length.CVE-2025-21446qualcomm, inc.snapdragon+235EPSS score0.24%
Transient DOS may occur when processing vendor-specific information elements while parsing a WLAN frame for BTM requests.CVE-2025-21442qualcomm, inc.snapdragon+26EPSS score0.11%
Memory corruption while transmitting packet mapping information with invalid header payload size.CVE-2025-21476qualcomm, inc.snapdragon+42EPSS score0.09%
Memory corruption when passing parameters to the Trusted Virtual Machine during the handshake.