8.4

CVE-2022-40522: qualcomm, inc. snapdragon Double Free

CVSS: 8.4v3.1HighModified
Published 06-06-2023Last modified 03-08-2024

Vulnerability summary

CVE-2022-40522 is a high (CVSS 8.4) Double Free vulnerability in qualcomm, inc. snapdragon. EPSS estimates a 0.12% chance of exploitation in the next 30 days, higher than 1.5% of scored vulnerabilities.

Overall risk
34/100
0100
Medium · default modelHow is this calculated?
CVSS score
8.4/10
010
High · v3.1 (CVE.org)
EPSS score
0.12%
0%100%
Low · 0.00 pp in 30 days
KEVNot listedIn no KEV catalog
RansomwareNone recordedNo known use recorded
Public exploits0No public exploits recorded

Timeline

  1. 06-06-2023
    PublishedVulnerability first disclosed.
  2. 03-08-2024
    Last modifiedVulnerability information updated.

Description

Memory corruption in Linux Networking due to double free while handling a hyp-assign.

CVSS metrics

2 scores · 2 sources · 1 version

EPSS trend

Probability

0.12%

Chance of exploitation in the next 30 days

Percentile

2%

Versus all other CVEs

30-day change

0.00 pp

From 0.12% on 21-09-2026

21-09-202621-10-2026
EPSS score
0.12%

Known exploited

Compare KEV catalogs

Not in any of the 3 tracked catalogs.

Public exploits

0 found

No public exploits indexed.

Weaknesses

CWE · root cause

Affected systems

Qualcomm54 products
Qualcomm, inc.1 product
  • snapdragonCSR8811 | FastConnect 6200 | IPQ6000 | IPQ6005 | IPQ6010 | IPQ6018 | IPQ6028 | IPQ9008 | IPQ9574 | QCA4024 | QCA6574A | QCA6574AU | QCA6595AU | QCA6696 | QCA8072 | QCA8075 | QCA8081 | QCA8082 | QCA8084 | QCA8085 | QCA8386 | QCN5021 | QCN5022 | QCN5052 | QCN5121 | QCN5122 | QCN5152 | QCN6023 | QCN6024 | QCN9000 | QCN9022 | QCN9024 | QCN9070 | QCN9072 | QCN9074 | QCN9274 | SA6145P | SA6150P | SA6155 | SA6155P | SA8145P | SA8150P | SA8155 | SA8155P | SA8195P | SM7250P | Snapdragon 765 5G Mobile Platform (SM7250-AA) | Snapdragon 765G 5G Mobile Platform (SM7250-AB) | Snapdragon 768G 5G Mobile Platform (SM7250-AC) | WCD9380 | WCD9385 | WSA8810 | WSA8815

2 vendors · 55 products

References

1 links