CVE-2023-33063: Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Vulnerability summary

CVE-2023-33063 is a high (CVSS 7.8) Use After Free vulnerability in Qualcomm Multiple Chipsets. It is known to be exploited: CISA lists it, first on 05-12-2023. EPSS estimates a 0.67% chance of exploitation in the next 30 days, higher than 51.2% of scored vulnerabilities.

Timeline

1. 05-12-2023
   PublishedVulnerability first disclosed.
2. 05-12-2023
   Added to CISA KEVQualcomm Multiple Chipsets Use-After-Free Vulnerability
3. 26-12-2023
   CISA remediation dueApply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
4. 21-10-2025
   Last modifiedVulnerability information updated.

Description

Memory corruption in DSP Services during a remote call from HLOS to DSP.

• CWE-416Use After FreeThe product reuses or references memory after it has been freed. At some point afterward, the memory may be allocated again and saved in another pointer, while the original pointer references a location somewhere within the new allocation. Any operations using the original pointer are no longer valid because the memory "belongs" to the code that operates on the new pointer.