CVE-2023-33106: Qualcomm Multiple Chipsets Use of Out-of-Range Pointer Offset Vulnerability
Vulnerability summary
CVE-2023-33106 is a high (CVSS 8.4) Use of Out-of-range Pointer Offset vulnerability in Qualcomm Multiple Chipsets. It is known to be exploited: CISA lists it, first on 05-12-2023. EPSS estimates a 0.79% chance of exploitation in the next 30 days, higher than 55.6% of scored vulnerabilities.
Timeline
- 05-12-2023PublishedVulnerability first disclosed.
- 05-12-2023Added to CISA KEVQualcomm Multiple Chipsets Use of Out-of-Range Pointer Offset Vulnerability
- 26-12-2023CISA remediation dueApply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
- 21-10-2025Last modifiedVulnerability information updated.
Description
Memory corruption while submitting a large list of sync points in an AUX command to the IOCTL_KGSL_GPU_AUX_COMMAND.
CVSS metrics
2 scores · 2 sources · 1 version- NVDNIST7.8HighCVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:HDiffers
EPSS trend
Probability
0.79%
Chance of exploitation in the next 30 days
Percentile
56%
Versus all other CVEs
30-day change
-0.14 pp
From 0.92% on 21-09-2026
Known exploited
Compare KEV catalogs- Added
- 05-12-2023
- Federal due date
- 26-12-2023
CISA required action
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable. nvd.nist.gov/vuln/detail/CVE-2023-33106
Public exploits
0 foundNo public exploits indexed.
Weaknesses
CWE · root cause- CWE-823Use of Out-of-range Pointer OffsetThe product performs pointer arithmetic on a valid pointer, but it uses an offset that can point outside of the intended range of valid memory locations for the resulting pointer.
- CWE-119Improper Restriction of Operations within the Bounds of a Memory BufferThe product performs operations on a memory buffer, but it reads from or writes to a memory location outside the buffer's intended boundary. This may result in read or write operations on unexpected memory locations that could be linked to other variables, data structures, or internal program data.
Affected systems
Qualcomm147 products
- ar8035_firmwarena
- csra6620_firmwarena
- csra6640_firmwarena
- fastconnect_6200_firmwarena
- fastconnect_6700_firmwarena
Qualcomm, inc.1 product
- snapdragonAR8035 | CSRA6620 | CSRA6640 | FastConnect 6200 | FastConnect 6700 | FastConnect 6800 | FastConnect 6900 | FastConnect 7800 | Flight RB5 5G Platform | QAM8255P | QAM8295P | QAM8650P | QAM8775P | QCA6174A | QCA6391 | QCA6426 | QCA6436 | QCA6574 | QCA6574A | QCA6574AU | QCA6595 | QCA6595AU | QCA6696 | QCA6698AQ | QCA6797AQ | QCA8081 | QCA8337 | QCA9377 | QCM2290 | QCM4290 | QCM4325 | QCM4490 | QCM5430 | QCM6490 | QCM8550 | QCN6024 | QCN9011 | QCN9012 | QCN9024 | QCS2290 | QCS410 | QCS4290 | QCS4490 | QCS5430 | QCS610 | QCS6490 | QCS7230 | QCS8250 | QCS8550 | QRB5165M | QRB5165N | Qualcomm 215 Mobile Platform | Qualcomm Video Collaboration VC1 Platform | Qualcomm Video Collaboration VC3 Platform | Qualcomm Video Collaboration VC5 Platform | Robotics RB5 Platform | SA4150P | SA4155P | SA6145P | SA6150P | SA6155P | SA8145P | SA8150P | SA8155P | SA8195P | SA8255P | SA8295P | SA8770P | SA8775P | SA9000P | SD 8 Gen1 5G | SD660 | SD865 5G | SD888 | SG4150P | SG8275P | SM4125 | SM7250P | SM7315 | SM7325P | SM8550P | Smart Audio 400 Platform | Snapdragon 4 Gen 1 Mobile Platform | Snapdragon 4 Gen 2 Mobile Platform | Snapdragon 439 Mobile Platform | Snapdragon 460 Mobile Platform | Snapdragon 480 5G Mobile Platform | Snapdragon 480+ 5G Mobile Platform (SM4350-AC) | Snapdragon 660 Mobile Platform | Snapdragon 662 Mobile Platform | Snapdragon 680 4G Mobile Platform | Snapdragon 685 4G Mobile Platform (SM6225-AD) | Snapdragon 690 5G Mobile Platform | Snapdragon 695 5G Mobile Platform | Snapdragon 750G 5G Mobile Platform | Snapdragon 765 5G Mobile Platform (SM7250-AA) | Snapdragon 765G 5G Mobile Platform (SM7250-AB) | Snapdragon 768G 5G Mobile Platform (SM7250-AC) | Snapdragon 778G 5G Mobile Platform | Snapdragon 778G+ 5G Mobile Platform (SM7325-AE) | Snapdragon 780G 5G Mobile Platform | Snapdragon 782G Mobile Platform (SM7325-AF) | Snapdragon 7c+ Gen 3 Compute | Snapdragon 8+ Gen 1 Mobile Platform | Snapdragon 8+ Gen 2 Mobile Platform | Snapdragon 865 5G Mobile Platform | Snapdragon 865+ 5G Mobile Platform (SM8250-AB) | Snapdragon 870 5G Mobile Platform (SM8250-AC) | Snapdragon 888 5G Mobile Platform | Snapdragon 888+ 5G Mobile Platform (SM8350-AC) | Snapdragon AR2 Gen 1 Platform | Snapdragon Auto 5G Modem-RF | Snapdragon W5+ Gen 1 Wearable Platform | Snapdragon X12 LTE Modem | Snapdragon X55 5G Modem-RF System | Snapdragon X65 5G Modem-RF System | Snapdragon XR2 5G Platform | Snapdragon XR2+ Gen 1 Platform | SSG2115P | SSG2125P | SW5100 | SW5100P | SXR1230P | SXR2130 | SXR2230P | WCD9326 | WCD9335 | WCD9341 | WCD9370 | WCD9375 | WCD9380 | WCD9385 | WCD9390 | WCD9395 | WCN3615 | WCN3660B | WCN3680B | WCN3910 | WCN3950 | WCN3980 | WCN3988 | WCN3990 | WCN6740 | WSA8810 | WSA8815 | WSA8830 | WSA8832 | WSA8835 | WSA8840 | WSA8845 | WSA8845H
2 vendors · 148 products
References
2 links- www.cisa.gov/known-exploited-vulnerabilities-catalog?field_cve=CVE-2023-33106Government ResourceUS Government Resource