CVE-2026-24077: qualcomm, inc. snapdragon Integer Underflow (Wrap or Wraparound)

Vulnerability summary

CVE-2026-24077 is a medium (CVSS 6.5) Integer Underflow (Wrap or Wraparound) vulnerability in qualcomm, inc. snapdragon. EPSS estimates a 0.17% chance of exploitation in the next 30 days, higher than 5.5% of scored vulnerabilities.

Timeline

1. 04-08-2026
   PublishedVulnerability first disclosed.
2. 04-08-2026
   Last modifiedVulnerability information updated.

Description

Information Disclosure when processing wireless network channel switch information with improperly formatted length fields.

• CWE-191Integer Underflow (Wrap or Wraparound)The product subtracts one value from another, such that the result is less than the minimum allowable integer value, which produces a value that is not equal to the correct result.